• Effective cooling of high-power electronics.
  • Waste heat recovery for energy purposes.
  • Reduction of the carbon footprint of data centers.

  • Heat conduction in the solid parts is modeled considering material features.
  • Heat convection in air and liquid regions is modeled.
  • Heat transfer between air, liquid and solid regions is calculated based on the energy balance.
  • Thermal effect of the thermal paste is considered.